1302 Effect of Previous Acid Etching on Bonding of Self-etch Adhesives

Saturday, March 24, 2012: 9:45 a.m. - 11 a.m.
Presentation Type: Poster Session
K. TSUBOTA1, M. MIYAZAKI1, S. ANDO1, T. TAKAMIZAWA1, and M.A. LATTA2, 1School of Dentistry, Nihon University, Tokyo, Japan, 2School of Dentistry, Creighton University, Omaha, NE

Objectives: This study was carried out to evaluate the effect of previous phosphoric acid etching on enamel bond strength of single-step self-etch adhesives.

Methods: Four single-step self-etch adhesives: G-Bond Plus (GC), iBond Self etch (Heraeus Kulzer), Optibond all in one (sds Kerr) and Xeno V (Dentsply) were used. Flattened enamel surfaces were accomplished on human teeth by wet ground to a #600 surface. After with or without phosphoric acid etching, adhesive was applied with or without agitation for manufactures' recommended contact time, and then resin composite (TPH3: Dentsply) was bonded to treated enamel using an Ultradent bonding fixture and light cured. Ten samples per test group were stored in 37C distilled water for 24 h, then shear tested at a crosshead speed of 1.0 mm/min. ANOVA and Tukey HSD tests were done at a significant level of 0.05. Scanning electron microscopic (SEM) observations of the adhesive treated enamel surfaces were also conducted.

Results: Shear bond strength (MPa)

Conclusion: The data suggests that previous acid etching significantly affect the bond strengths of the single-application self-etch adhesive systems.


Keywords: Acid etch, Adhesion, Dentin bonding agents and Enamel