Ercan M. Dede
Ercan M. Dede
EDUCATION
Ph.D., Mechanical Engineering, University of Michigan, 2007
M.S., Mechanical Engineering, Stanford University, 2002
B.S., Mechanical Engineering, University of Michigan, 1998
RESEARCH INTERESTS
Multiphysics Simulation & Optimization:
Future sensor and advanced electrical machine design requires the multiphysics simulation and optimization of structures for increased efficiency and minimization of size, cost, and weight. Accordingly, this research is focused on the computational modeling, structural optimization, and experimental investigation of vehicle systems involving various combinations of heat transfer, fluid flow, thermal-stress, acoustic, structural dynamics, and/or electromagnetic processes.
BOOK
Dede, E.M., Lee, J., and Nomura, T., 2014. Multiphysics Simulation: Electromechanical System Applications and Optimization. Springer, London.
JOURNAL ARTICLES
1.Dede, E.M., Zhang, C., Wu, Q., Seyedhassantehrani, N., Shattique, M., Roy, S., Palko, J.W., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K.E., Giglio, R., and Asheghi, M., 2023. “Techno-economic feasibility analysis of an extreme heat flux micro-cooler.” iScience, 26 (1), 105812. DOI: 10.1016/j.isci.2022.105812 (Special Issue - Advanced thermal control: fundamentals and applications)
2.Lee, T., Li, X., Yu, Z., Nomura, T., Dede, E.M., and Iizuka, H., 2022. “Coupled acoustic resonance for wave control and sensing.” Frontiers in Physics, 1011. DOI: 10.3389/fphy.2022.998253
3.Schmalenberg, P., Dede, E.M., Nomura, T., and Nishiwaki, S., 2022. “Optimization of planar phased arrays for vehicles.” IEEE Antennas and Wireless Propagation Letters, 21 (10), pp. 2140-2144. DOI: 10.1109/LAWP.2022.3193655
4.Hazra, S., Zhang, C., Wu, Q., Asheghi, M., Goodson, K., Dede, E.M., Palko, J., and Narumanchi, S., 2022. “A novel hadmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies.” Scientific Reports, 12, 12180. DOI: 10.1038/s41598-022-16281-5
5.Dede, E.M., Zhou, Y., Tambo, T., Zhou, F., Lohan, D.J., and Nomura, T., 2022. “Measurement of low Reynolds number flow emanating from a Turing pattern microchannel array using a Bernoulli equation technique.” Experimental Thermal and Fluid Science, 139, 110722. DOI: 10.1016/j.expthermflusci.2022.110722
6.Rodrigues, S., Cunha, P., Kudtarkar, K., Dede, E.M., and Lan, S., 2022. “Review of optically active and nonlinear chiral metamaterials.” Journal of Nanophotonics, 16 (2), 020901. DOI: 10.1117/1.JNP.16.020901
7.Zhou, Y., Nomura, T., Dede, E.M., and Saitou, K., 2022. “Topology optimization with wall thickness and piecewise developability constraints for foldable shape-changing structures.” Structural and Multidisciplinary Optimization, 65, 118. DOI: 10.1007/s00158-022-03219-8
8.Liu, J., Xian, Z., Zhou, Y., Nomura, T., Dede, E.M., and Zhu, B., 2022. “A marker-and-cell method for large-scale flow-based topology optimization on GPU.” Structural and Multidisciplinary Optimization, 65, 125. DOI: 10.1007/s00158-022-03214-z
9.Zhou, Y., Lohan, D.J., Zhou, F., Nomura, T., and Dede, E.M., 2022. “Inverse design of microreactor flow fields through anisotropic porous media optimization and dehomogenization.” Chemical Engineering Journal, 435, 134587. DOI: 10.1016/j.cej.2022.134587
10.Jung, T., Lee, J., Nomura, T., and Dede, E.M., 2022. “Inverse design of three-dimensional fiber reinforced composites with spatially-varying fiber size and orientation using multiscale topology optimization.” Composites Structures, 279, 114768. DOI: 10.1016/j.compstruct.2021.114768
11.Dede, E.M., Gao, Y., Zhou, Y., Sankaranarayanan, V., Zhou, F., Maksimovic, D., and Erickson, R.W., 2021. “Thermal design, optimization and packaging of planar magnetic components.” IEEE Transactions on Components, Packaging, and Manufacturing Technology, 11 (9), pp. 1480-1488. DOI: 10.1109/TCPMT.2021.3105003
12.Gao, Y., Sankaranarayanan, V., Dede, E.M., Zhou, Y., Zhou, F., Erickson, R.W., and Maksimovic, D., 2021. “Modeling and design of high-power, high-current-ripple planar inductors.” IEEE Transactions of Power Electronics, In press. DOI: 10.1109/TPEL.2021.3132563
13.Tavakoli, R., Dede, E.M., Chou, C., and Pantic, Z., 2021. “Cost-efficiency optimization of ground assemblies for dynamic wireless charging of electric vehicles.” IEEE Transactions on Transportation Electrification, In press. DOI: 10.1109/TTE.2021.3105573
14.Tavakoli, R., Shabanian, T., Dede, E.M., Chou, C., and Pantic, Z., 2021. “EV misalignment estimation in DWPT systems utilizing the roadside charging pads.” IEEE Transactions on Transportation Electrification, In press. DOI: 10.1109/TTE.2021.3091969
15.Lee, J., Kwon, C., Yoo, J., Min, S., Nomura, T., and Dede, E.M., 2021. “Design of spatially-varying orthotropic infill structures using multiscale topology optimization and explicit de-homogenization.” Additive Manufacturing, 40, 101920. DOI: 10.1016/j.addma.2021.101920
16.Muratori, M., Alexander, M., Arent, D., Bazilian, M., Cazzola, P., Dede, E.M., et al., 2021. “The rise of electric vehicles - 2020 status and future expectations.” Progress in Energy, 3 (2), 022002. DOI: 10.1088/2516-1083/abe0ad
17.Rodrigues, S.R., Yu, Z., Schmalenberg, P., Lee, J., Iizuka, H., and Dede, E.M., 2021. “Weighing in on photonic-based machine learning for automotive mobility.” Nature Photonics, 15 (2), pp. 66-67. DOI: 10.1038/s41566-020-00736-0
18.Kim, J.C., Ren, Z., Yuksel, A., Dede, E.M., Bandaru, P.R., Oh, D., and Lee, J., 2021. “Recent advances in thermal metamaterials and their future applications for electronics packaging.” Journal of Electronic Packaging, 143 (1), 010801 (15 pages). DOI: 10.1115/1.4047414
19.Liu, T., Palko, J.W., Katz, J.S., Zhou, F., Dede, E.M., Asheghi, M., and Goodson, K.E., 2020. “Steady-state parametric optimization and transient characterization of heat flow regulation with binary diffusion.” IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (12), pp. 1996-2007. DOI: 10.1109/TCPMT.2020.3005880 (IEEE EPS TCPMT Best Paper Award, Components: Characterization and Modeling Category)
20.Jung, K.W., Cho, E., Lee, H., Kharangate, C., Zhou, F., Asheghi, M., Dede, E.M., and Goodson, K.E., 2020. “Thermal and manufacturing design considerations for silicon-based embedded microchannel-3D manifold coolers (EMMCs): Part 1 - experimental study of single-phase cooling performance with R-245fa.” Journal of Electronic Packaging, 142 (2), 031117 (10 pages). DOI: 10.1115/1.4047846
21.Kim, D., Lee, J., Nomura, T., Dede, E.M., Yoo, J., and Min, S., 2020. “Topology optimization of functionally graded anisotropic composite structures using homogenization design method.” Computer Methods in Applied Mechanics and Engineering, 369, 113220. DOI: 10.1016/j.cma.2020.113220
22.Yoon, G.H., Dede, E.M., Nomura, T., and Schmalenberg, P., 2020. “Topology optimization of time-transient heat conduction for thermo-optic silicon modulators.” International Journal of Heat and Mass Transfer, 157, 119862. DOI: 10.1016/j.ijheatmasstransfer.2020.119862
23.Lee, T., Nomura, T., Dede, E.M., and Iizuka, H., 2020. “Asymmetric loss-induced perfect sound absorption in duct silencers.” Applied Physics Letters, 116, 214101. DOI: 10.1063/5.0009631
24.Dede, E.M., Zhou, Y., and Nomura, T., 2020. “Inverse design of microchannel fluid flow networks using Turing pattern dehomogenization.” Structural and Multidisciplinary Optimization, 62, pp. 2203-2210. DOI: 10.1007/s00158-020-02580-w
25.Dede, E.M., Yu, Z., Schmalenberg, P., and Iizuka, H., 2020. “Thermal metamaterials for radiative plus conductive heat flow control.” Applied Physics Letters, 116, 191902. DOI: 10.1063/5.0007574 (Featured Article)
26.Lee, J., Nomura, T., and Dede, E.M., 2020. “Topology optimization of magnetic composite structures for electropermanent magnet.” Journal of Magnetism and Magnetic Materials, 503, 166596. DOI: 10.1016/j.jmmm.2020 .166596
27.Sudhakar, S., Weibel, J.A., Zhou, F., Dede, E.M., and Garimella, S.V., 2020. “The role of vapor venting and liquid feeding on the dryout limit of two-layer evaporator wicks.” International Journal of Heat and Mass Transfer, 148, 119063. DOI: 10.1016/j.ijheatmasstransfer.2019.119063
28.Chen, W., Zhang, L., Pattipati, K., Bazzi, A.M., Joshi, S.N., and Dede, E.M., 2020. “Data-driven approach for fault prognosis of SiC MOSFETs.” IEEE Transactions on Power Electronics, 35 (4), pp. 4048-4062. DOI: 10.1109/TPEL.2019.2936850
29.Joshi, S.N., Lohan, D.J., and Dede, E.M., 2020. “Two-phase performance of a hybrid jet plus multi-pass microchannel heat sink.” Journal of Thermal Science and Engineering Applications, 12 (1), 011019 (9 pages). DOI: 10.1115/1.4044347
30.Lohan, D.J., Dede, E.M., and Allison, J.T., 2020. “A study on practical objectives and constraints for heat conduction topology optimization.” Structural and Multidisciplinary Optimization, 61 (2), pp. 475-489. DOI: 10.1007/s00158-019-02369-6
31.Liu, Y., Joshi, S.N., and Dede, E.M., 2020. “Novel transient liquid phase bonding for high-temperature automotive power electronics systems.” Journal of Electronic Packaging, 142 (1), 011003 (10 pages). DOI: 10.1115/1.4044476
32.Liu, T., Palko, J.W., Katz, J.S., Dede, E.M., Zhou, F., Asheghi, M., and Goodson, K.E., 2019. “Tunable, passive thermal regulation through liquid to vapor phase change.” Applied Physics Letters, 115, 254102. DOI: 10.1063/1.5133795
33.Lee, T., Nomura, T., Schmalenberg, P., Dede, E.M., and Iizuka, H., 2019. “Directional acoustic superscattering by coupled resonators.” Physical Review Applied, 12, 054059. DOI: 10.1103/PhysRevApplied.12.054059
34.Zhou, F., Joshi, S.N., Liu, Y., and Dede, E.M., 2019. “Near-junction cooling for next-generation power electronics.” International Communications in Heat and Mass Transfer, 108, 104300. DOI: 10.1016/j.icheatmasstransfer.2019.104300
35.Nomura, T., Kawamoto, A., Kondoh, T., Dede, E.M., Lee, J., Song, Y., and Kikuchi, N., 2019. “Inverse design of structure and fiber orientation by means of topology optimization with tensor field variables.” Composites Part B: Engineering, 176. DOI: 10.1016/j.compositesb.2019.107187
36.Take, N., Joshi, S.N., and Dede, E.M., 2019. “Self-healing technology for metallic die attach materials in electronics.” Advanced Engineering Materials, 121 (8). DOI: 10.1002/adem.201900245
37.Zhou, F., Liu, Y., and Dede, E.M., 2019. “Design, fabrication, and performance evaluation of a hybrid wick vapor chamber.” Journal of Heat Transfer, 141 (8), 081802. DOI: 10.1115/1.4043797
38.Sudhakar, S., Weibel, J.A., Zhou, F., Dede, E.M., and Garimella, S.V., 2019. “Area-scalable high-heat-flux dissipation at low thermal resistance using a capillary-fed two-layer evaporator wick.” International Journal of Heat and Mass Transfer, 135, pp. 1346-1356. DOI: 10.1016/j.ijheatmasstransfer.2019.02.075
39.Lee, T., Nomura, T., Dede, E.M., and Iizuka, H., 2019. “Ultrasparse acoustic absorbers enabling fluid flow and visible-light controls.” Physical Review Applied, 11 (2), 024022. DOI: 10.1103/PhysRevApplied.11.024022
40.Regalado, I.L., Williams, J.J., Joshi, S., Dede, E.M., Liu, Y., and Chawla, N., 2019. “X-ray microtomography of thermal cycling damage in sintered nano-silver solder joints.” Advanced Engineering Materials, 21 (3). DOI: 10.1002/adem.201801029
41.Shin, J.-W., Ishigaki, M., Dede, E.M., and Lee, J.S., 2019. “MagCap DC-DC converter utilizing GaN devices: design consideration and quasi-resonant operation.” IEEE Transactions on Power Electronics, 34 (3), pp. 2441-2453. DOI: 10.1109/TPEL.2018.2845379
42.Wilkins, M.M., Ishigaki, M., Provost, P.-O., Valdivia, C., Fafard, S., Masson, D., Dede, E.M., and Hinzer, K., 2019. “Ripple-free boost-mode power supply using photonic power conversion.” IEEE Transactions on Power Electronics, 34 (2), pp. 1054-1064. DOI: 10.1109/TPEL.2018.2843158 (Highlighted Paper)
43.Jung, K.W., Kharangate, C.R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E.M., and Goodson, K.E., 2019. “Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance.” International Journal of Heat and Mass Transfer, 130, pp. 1108-1119. DOI: 10.1016/j.ijheatmasstransfer.2018.10.108
44.Lee, J., Nomura, T., and Dede, E.M., 2019. “Asymptotic homogenization of magnetic composite for controllable permanent magnet.” Composites Part B: Engineering, 161, pp. 128-140. DOI: 10.1016/j.compositesb/2018.10.05
45.Dede, E.M., Liu, Y., Joshi, S., Zhou, F., Lohan, D., and Shin, J.-W, 2018. “Optimal design of three-dimensional heat flow structures for power electronics applications.” Journal of Thermal Sciences and Engineering Applications, 11 (2), 021011 (12 pages). DOI: 10.1115/1.4041440
46.Shin., J.-W., Wang, C.-M., and Dede, E.M., 2018. “Power semiconductor module with low-permittivity material to reduce common-mode electromagnetic interference.” IEEE Transactions on Power Electronics, 33 (12), pp. 10027-10031. DOI: 10.1109/TPEL.2018.2828041
47.Lee, J.W., Kim, D., Nomura, T., Dede, E.M., and Yoo, J., 2018. “Topology optimization for continuous and discrete orientation design of functionally graded fiber-reinforced composites structures.” Composite Structures, 201, pp. 217-233. DOI: 10.1016/j.compstruct.2018.06.020
48.Dede, E.M., Zhou, F., Schmalenberg, P., and Nomura, T., 2018. “Thermal metamaterials for heat flow control in electronics.” Journal of Electronic Packaging, 140 (1), 010904 (10 pages). DOI: 10.1115/1.4039020
49.Dede, E.M., Wang, C.-M., Liu, Y., Schmalenberg, P., Zhou, F., Shin, J.-W., and Ishigaki, M., 2018. “Electrothermal circuit design with heat flow control - Synchronous buck converter case study.” IEEE Transactions on Components, Packaging, and Manufacturing Technology, 8 (2), pp. 226-235. DOI: 10.1109/TCPMT.2017.2773266
50.Lee, J., Yoon, M., Nomura, T., and Dede, E.M., 2017. “Topology optimization for design of segmented permanent magnet arrays with ferromagnetic materials.” Journal of Magnetism and Magnetic Materials, 449, pp. 571-581. DOI: 10.1016/j/jmmm.2017.10.109
51.Lee, J., Nomura, T., and Dede, E.M., 2017. “Topology optimization of Halbach magnet arrays using isoparametric projection.” Journal of Magnetism and Magnetic Materials, 432, pp. 140-153. DOI: 10.1016/j.jmmm.2017.01.092
52.Zhou, F., Joshi, S.N., Rhote-Vaney, R., and Dede, E.M., 2017. “A review and future application of Rankine Cycle to passenger vehicles for waste heat recovery.” Renewable and Sustainable Energy Reviews, 75, pp. 1008-1021. DOI: 10.1016/j.rser.2016.11.080
53.Ishigaki, M., Shin, J.-W., and Dede, E.M., 2017. “A novel soft switching bidirectional DC-DC converter using magnetic and capacitive hybrid power transfer.” IEEE Transactions on Power Electronics, 32 (9), pp. 6961-6970. DOI: 10.1109/TPEL.2016.2624024
54.Lohan, D.J., Dede, E.M., and Allison, J.T., 2017. “Topology optimization for heat conduction using generative algorithms.” Structural and Multidisciplinary Optimization, 55 (3), pp. 1063-1077. DOI: 10.1007/s00158-016-1563-6
55.Joshi, S.N., and Dede, E.M., 2017. ”Two-phase jet impingement cooling for high heat flux wide band-gap devices using multi-scale porous surfaces.” Applied Thermal Engineering, 110, pp. 10-17. DOI: 10.1016/j.applthermaleng.2016.08.146
56.Dede, E.M., Schmalenberg, P., Wang, C.-M., Zhou, F., and Nomura, T., 2016. “Collection of low-grade waste heat for enhanced energy harvesting.” AIP Advances, 6 (5), 055113 (6 pages). DOI: 10.1063/1.4950861
57.Zhou, F., Dede, E.M., and Joshi, S.N., 2016. “Application of Rankine cycle to passenger vehicle waste heat recovery - a review.” SAE International Journal of Materials and Manufacturing, 9 (2), pp. 224-235. DOI: 10.4271/2016-01-0178
58.Qian, X., and Dede, E.M., 2016. “Topology optimization of a coupled thermal-fluid system under a tangential thermal gradient constraint.” Structural and Multidisciplinary Optimization, 54 (3), pp. 531-551. DOI: 10.1007/s00158-016-1421-6
59.Zhou, F., Liu, Y., Liu, Y., Joshi, S.N., and Dede, E.M., 2015. “Modular design for a single-phase manifold mini/microchannel cold plate.” Journal of Thermal Science and Engineering Applications, 8 (2), 021010 (13 pages). DOI: 10.1115/1.4031932
60.Dede, E.M., Schmalenberg, P., Nomura, T., and Ishigaki, M., 2015. “Design of anisotropic thermal conductivity in multi-layer printed circuit boards.” IEEE Transactions on Components, Packaging, and Manufacturing Technology, 5 (12), pp. 1763-1774. DOI: 10.1109/TCPMT.2015.2473103 (Selected for Issue Cover)
61.Dede, E.M., Joshi, S.N., and Zhou, F., 2015. “Topology optimization, additive layer manufacturing, and experimental testing of an air-cooled heat sink.” Journal of Mechanical Design, 137 (11), 111403 (9 pages). DOI: 10.1115/1.4030989
62.Rau, M.J., Garimella, S.V., Dede, E.M., and Joshi, S.N., 2015. “Boiling heat transfer from an array of round jets with hybrid surface enhancements.” Journal of Heat Transfer, 137 (7), 071501 (9 pages). DOI: 10.1115/1.4029969
63.Nomura, T., Dede, E.M., Lee, J., Yamasaki, S., Matsumori, T., Kawamoto, A., and Kikuchi, N., 2015. “General topology optimization method with continuous and discrete orientation design using isoparametric projection.” International Journal for Numerical Methods in Engineering, 101 (8), pp. 571-605. DOI: 10.1002/nme.4799
64.Joshi, S.N., and Dede, E.M., 2015. “Effect of sub-cooling on performance of a multi-jet two phase cooler with multi-scale porous surfaces.” International Journal of Thermal Sciences, 87, pp. 110-120. DOI: 10.1016/j.ijthermalsci.2014.08.014
65.Rau, M.J., Dede, E.M., and Garimella, S.V., 2014. “Local single- and two-phase heat transfer from an impinging cross-shaped jet.” International Journal of Heat and Mass Transfer, 79, pp. 432-436. DOI: 10.1016/j.ijheatmasstransfer.2014.08.012.
66.Dede, E.M., Nomura, T., and Lee, J., 2014. “Thermal-composite design optimization for heat flux shielding, focusing, and reversal.” Structural and Multidisciplinary Optimization, 49 (1), pp. 59-68. DOI: 10.1007/s00158-013-0963-0.
67.Dede, E.M., Nomura, T., Schmalenberg, P., and Lee, J.S., 2013. “Heat flux cloaking, focusing, and reversal in ultra-thin composites considering conduction-convection effects.” Applied Physics Letters, 103 (6), 063501 (4 pages). DOI: 10.1063/1.4816775. (Featured Article, Issue Cover)
68.Dede, E.M., and Liu, Y., 2013. “Experimental and numerical investigation of a multi-pass branching microchannel heat sink.” Applied Thermal Engineering, 55 (1-2), pp. 51-60. DOI:10.1016/j.applthermaleng.2013.02.038.
69.Lee, J., Nomura, T., and Dede, E.M., 2012. “Heat flow control in thermo-magnetic convective systems using engineered magnetic fields.” Applied Physics Letters, 101 (12), 123507 (4 pages). DOI: 10.1063/1.4754119.
70.Dede, E.M., 2012. “Optimization and design of a multipass branching microchannel heat sink for electronics cooling.” Journal of Electronic Packaging, 134 (4), 041001 (10 pages). DOI: 10.1115/1.4007159. (2012/2013 ASME EPPD, JEP, Best Paper of the Year Award)
71.Dede, E.M., Lee, J., Guo, Y., Qin Zhou, L., Zhang, M., and Banerjee, D., 2012. “Kilohertz magnetic field focusing and force enhancement using a metallic loop array.” Applied Physics Letters, 101 (2), 023506 (4 pages). DOI: 10.1063/1.4737003.
72.Lee, J., Dede, E.M., Banerjee, D., and Iizuka, H., 2012. “Magnetic force enhancement in a linear actuator by air-gap magnetic field distribution optimization and design.” Finite Elements in Analysis and Design, 58, pp. 44-52. DOI: 10.1016/j.finel.2012.04.007.
73.Dede, E.M., Lee, J., Liu, Y., Robert, B., and Yonak, S., 2012. “Computational methods for the optimization and design of electromechanical vehicle systems.” International Journal of Vehicle Design, 58 (2/3/4), pp. 159-180. DOI: 10.1504/IJVD.2012.047383.
74.Banerjee, D., Lee, J., Dede, E.M., and Iizuka, H., 2011. “Kilohertz magnetic field focusing in a pair of metallic periodic-ladder structures.” Applied Physics Letters, 99 (9), 093501 (3 pages). DOI: 10.1063/1.3629992.
75.Lee, J., Dede, E.M., and Nomura, T., 2011. “Simultaneous design optimization of permanent magnet, coils, and ferromagnetic material in actuators.” IEEE Transactions on Magnetics, 47 (12), pp. 4712-4716. DOI: 10.1109/TMAG.2011.2160870.
76.Dede, E.M., 2010. “Simulation and optimization of heat flow via anisotropic material thermal conductivity.” Computational Materials Science, 50 (2), pp. 510-515. DOI: 10.1016/j.commatsci.2010.09.012.
77.Dede, E.M., and Hulbert, G.M., 2009. “Topology optimization of structures with integral compliant mechanisms for mid-frequency response.” Structural and Multidisciplinary Optimization, 39 (1), pp. 29-45. DOI: 10.1007/s00158-008-0312-x.
78.Dede, E.M., and Hulbert, G.M., 2008. “Computational analysis and design of lattice structures with integral compliant mechanisms.” Finite Elements in Analysis and Design, 44 (14), pp. 819-830. DOI: 10.1016/j.finel.2008.06.003.
79.Dede, E.M., and Hulbert, G.M., 2008. “Mid-frequency response of structures with integral compliant mechanisms: verification and validation.” Journal of Sound and Vibration, 313 (3-5), pp. 493-509. DOI: 10.1016/j.jsv.2007.12.021.
80.Dede, E.M., and Hulbert, G.M., 2008. “Analysis, design, and optimization of structures with integral compliant mechanisms for mid-frequency response.” International Journal for Numerical Methods in Engineering, 73 (4), pp. 470-492. DOI: 10.1002/nme.2084.
CONFERENCE PRESENTATIONS & TECHNICAL PUBLICATIONS
1.Dede, E.M., 2022. “Thermal design, optimization and packaging of planar magnetic components.” 2022 IEEE Energy Conversion Congress & Expo (ECCE), Detroit, MI. (Special Session Invited Talk)
2.Zhu, G., Wang, L., Zhou, Y., Kawai, H., Ando, M., Dede, E.M., Jia, H., Zenyuk, I.V., and Banerjee, D., 2022. “Developing next generation high performance polymer electrolyte membrane fuel cells using metal foam as gas diffusion layer.” 242nd ECS Meeting Abstracts, Vol. MA2022-02, 1378. DOI: 10.1149/MA2022-02391378mtgabs
3.Lohan, D.J., Zhou, Y., and Dede, E.M., 2022. “Generative design for electronics cooling.” Electronics Cooling Magazine.
4.Zhou, Y., Nomura, T., Dede, E.M., and Saitou, K., 2021. ““Topology optimization with wall thickness and developability constraints for foldable shape-changing structures.” 14th World Congress on Structural and Multidisciplinary Optimization (WCSMO14), Boulder, CO.
5.Dede, E.M., 2021. “Simulation-based design and optimization for future mobility electronics systems.” 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), St. Julian, Malta. DOI: 10.1109/EuroSimE52062.2021.9410864 (Invited Industry Keynote)
6.Tavakoli, R., Pratik, U., Dede, E.M., Chou, C., and Pantic, Z., 2021. “Minimizing the rebar impact on power dissipation in dynamic wireless power transfer systems.” 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), Phoenix, AZ. DOI: 10.1109/APEC42165.2021.9487149
7.Dede, E.M., 2020. Invited Lecture for University of Colorado Boulder Graduate Course on Power Electronics for Electric Drive Vehicles. University of Colorado Boulder.
8.Dede, E.M., 2020. Invited Lecture for Purdue ME511 Graduate Course on Thermal Management of Electronics. Purdue University.
9.Dede, E.M., 2020. COMSOL’s Virtual 2020 User’s Conference. (Invited Panel Session)
10.Dede, E.M., 2020. “Design optimization techniques and multiphysics considerations for thermal metamaterials.” 2020 International Conference on Thermodynamics and Thermal Metamaterials (ThermoMeta2020). (Invited Talk)
11.Dede, E.M., 2020. “Packaging and thermal challenges for integrated power electronics.” Thermal Management for Power Electronics and Storage (TMPES), 2020 Virtual Workshop. (Invited Talk)
12.Zhou, Y., Nomura, T., and Dede, E.M., 2020. “Topology optimization of manifold microchannel heat sinks.” 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). DOI: 10.1109/ITherm45881.2020.9190257
13.Joshi, S.N., Yu, Z., Sennoun, H., and Hampshire, J., 2020. “Single-phase cooling performance of a topology optimized and additively-manufactured multi-pass branching microchannel heat sink.” 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). DOI: 10.1109/ITherm45881.2020.9190597
14.Joshi, S.N., Zhou, F., Dede, E.M., Lohan, D.J., Sudhakar, S., and Weibel, J.A., 2020. “Thermal performance evaluation of a two-layer wick vapor chamber for high heat flux dissipation by air cooling.” 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). DOI: 10.1109/ITherm45881.2020.9190372
15.Yokoyama, H., Schmalenberg, P., Farooq, M., and Dede, E.M., 2020. “Gesture recognition by machine learning combined with geometric calculation.” IEEE 23rd International Conference on Intelligent Transportation Systems (ITSC), pp. 1-6. DOI: 10.1109/ITSC45102.2020.9294347
16.Jung, K.W., Zhou, F., Asheghi, M., Dede, E.M., and Goodson, K.E., 2019. “Experimental study of single-phase cooling with DI water in an embedded microchannels-3D manifold cooler.” IEEE 21st Electronics Packaging Technology Conference (EPTC), pp. 164-166, Singapore. DOI: 10.1109/EPTC47984.2019.9026600
17.Liu, T., Palko, J., Katz, J., Dede, E.M., Zhou, F., Asheghi, M., and Goodson, K.E., 2019. “Fabrication and characterization of a phase change based thermal switch.” ASME International Conference on Nanochannels, Microchannels, and Minichannels (ICNMM), ICNMM2019-4325, Newfoundland, Canada.
18.Dede, E.M., Yoon, G.H., Schmalenberg, P., and Nomura, T., 2019. “Topology optimization of time-transient heat conduction for thermo-optic devices.” ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2019), IPACK2019-6526, Anaheim, CA.
19.Sudhakar, S., Weibel, J.A., Zhou, F., Dede, E.M., and Garimella, S.V., 2019. “Demonstration of two-layer wicks for high-heat-flux dissipation in vapor chambers.” ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2019), IPACK2019-6367, Anaheim, CA.
20.Jung, K.W., Lee, H., Kharangate, C., Zhou, F., Asheghi, M., Dede, E.M., and Goodson, K.E., 2019. Experimental investigation of single-phase cooling in embedded microchannels: 3D manifold heat exchanger with R-245fa.” ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2019), IPACK2019-6400, Anaheim, CA. DOI: 10.1115/IPACK2019-6400
21.Gao, Y., Sankaranarayanan, V., Dede, E.M., Ghosh, A., Maksimovic, D., and Erickson, R.W., 2019. “Drive-cycle optimized 99% efficient SiC boost converter using planar inductor with enhanced thermal management.” 20th Workshop on Control and Modeling for Power Electronics (COMPEL), Toronto, ON. DOI: 10.1109/COMPEL.2019.8769694
22.Liu, Y., Joshi, S.N., and Dede, E.M., 2019. “Reliability of laminated bond structure using (Cu,Ni)/Sn TLP bonding with Al interlayer for high-temperature power electronics packaging.” IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV.
23.Nomura, T., Kawamoto, A., Kondoh, T., Lee, J., Song, Y., and Dede, E.M., 2019. “Topology optimization method with orientation field design variables.” World Congress on Structural and Multidisciplinary Optimization (WCSMO13), Beijing, China.
24.Lee, J, Nomura, T., and Dede, E.M., 2019. “Topology optimization of functionally graded fiber-reinforced composite for compliant mechanism.” World Congress on Structural and Multidisciplinary Optimization (WCSMO13), Beijing, China.
25.Dede, E.M., 2019. “Novel thermal and packaging paradigms for next-generation power electronics.” International Workshop on Integrated Power Packaging (IWIPP), Toulouse, France. (Invited Plenary Talk)
26.Dede, E.M., 2019. Invited Lecture for Purdue ME511 Graduate Course on Thermal Management of Electronics. Purdue University.
27.Gurpinar, E., Wiles, R., Ozpineci, B., Raminosoa, T., Zhou, F., Liu, Y., and Dede, E.M., 2018. “SiC MOSFET-based power module design and analysis for EV traction systems.” 2018 IEEE Energy Conversion Congress & Expo (ECCE), Portland, OR. DOI: 10.1109/ECCE.2018.8557609
28.Zhou, F., Liu, Y., Fan, T., and Dede, E.M., 2018. “Hybrid wick vapor chamber thermal performance evaluation for high heat flux application by air cooling.” 16th International Heat Transfer Conference (IHTC16), Beijing, China. DOI: 10.1615/IHTC16.ctm.022763
29.Dede, E.M., 2018. “Microscale electronic and photonic devices - thermal optimization & fabrication.” ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2018), InterPACK2018-8554, San Francisco, CA. (Invited Presentation)
30.Liu, T., Palko, J., Katz, J., Kharangate, C.R., Dede, E.M., Zhou, F., Asheghi, M., and Goodson, K.E., 2018. “Thermal switching through liquid to vapor phase change.” ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2018), San Francisco, CA.
31.Dede, E.M., 2018. “Thermal design optimization in electronic systems.” 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), San Diego, CA. (Invited Technology-Talk)
32.Zhou, F., Jung, K.W., Fukuoka, Y., and Dede, E.M., 2018. “Chip-scale cooling of power semiconductor devices: Fabrication of jet impingement design.” 2018 IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD), Chicago, IL. DOI: 10.1109/ISPSD.2018.8393716
33.Zhou, F., Joshi, S.N., and Dede, E.M., 2017. “Thermal energy harvesting with next generation cooling for automotive electronics.” Electronics Cooling Magazine.
34.Shin, J.-W., Ishigaki, M., Dede, E.M., and Lee, J.S., 2017. “Bidirectional DC-DC converter utilizing magnetic and capacitive power transfer - 97.1% efficiency at 1.2-MHz switching.” 2017 IEEE Energy Conversion Congress and Exposition (ECCE), Cincinnati, OH. DOI: 10.1109/ECCE.2017.8096948
35.Dede, E.M., Zhou, F., Schmalenberg, P., and Nomura, T., 2017. “Thermal metamaterials for heat flow control in electronics.” ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2017), IPACK2017-74112, San Francisco, CA. DOI: 10.1115/IPACK2017-74112
36.Sitaraman, H., Moreno, G., Dede, E.M., Joshi, S.N., Zhou, F., and Narumanchi, S., 2017. “Local-scale simulations of nucleate boiling from micrometer-featured surfaces.” ASME 2017 Heat Transfer Summer Conference, HT2017-4710, Bellevue, WA. DOI: 10.1115/HT2017-4710
37.Dede, E.M., Zhou, F., and Joshi, S.N., 2017. “Concepts for embedded cooling of vertical current wide band-gap semiconductor devices.” 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL. DOI: 10.1109/ITHERM.2017.7992529
38.Zhou, F., Liu, Y., Joshi, S.N., Dede, E.M., Chen, X., and Weibel, J., 2017. “Vapor chamber with thermal diode and switch functions.” 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL. DOI: 10.1109/ITHERM.2017.7992518
39.Jung, K.W., Kharangate, C., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E.M., and Goodson, K., 2017. “Microchannel cooling strategies for high heat flux (1 kW/cm^2) power electronics applications.” 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL. DOI: 10.1109/ITHERM.2017.7992457
40.Dede, E.M., 2017. “Multi-scale optimization strategies for electronics thermal management and energy harvesting.” SEMI-THERM 33, San Jose, CA. (Invited Luncheon Talk)
41.Rau, M.J., Dede, E.M., and Joshi, S.N., 2016. “Enhanced two-phase impingement technologies for electronics cooling.” Electronics Cooling Magazine.
42.Dede, E.M., 2016. “Thermal management technologies for high power density electronics.” SAE Thermal Management Systems Symposium (TMSS 2016), Mesa, AZ. (Keynote Presentation)
43.Lohan, D.J., Ishigaki, M., Dede, E.M., and Allison, J.T., 2016. “Combined lumped and continuum parameter design optimization of electro-thermal systems.” ASME 2016 International Design Engineering Technical Conferences (IDETC 2016), IDETC2016-60218, Charlotte, NC. DOI: 10.1115/DETC2016-60218 (Nominated for DAC Best Paper Award)
44.Dede, E.M., Ishigaki, M., Joshi, S.N., and Zhou, F., 2016. “Design for additive manufacturing of wide band-gap power electronics components.” 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), Raleigh, NC. DOI: 10.1109/3DPEIM.2016.7570540 (Invited Paper)
45.Lohan, D.J., Allison, J.T., and Dede, E.M., 2016. “Topology optimization formulations for circuit board heat spreader design.” 17th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference, AIAA Aviation, AIAA 2016-3669, Washingtion, DC. DOI: 10.2514/6.2016-3669
46.Noguchi, M., Joshi, S.N., and Dede, E.M., 2016. “Design of mechanical properties of transient liquid phase bonds with tertiary metal particles.” IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV. DOI: 10.1109/ECTC.2016.26
47.Joshi, S.N., and Dede, E.M., 2016. “Thermal management of future WBG devices using two-phase cooling.” International Conference and Exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe 2016), Nuremberg, Germany.
48.Dede, E.M., Zhou, F., and Joshi, S.N., 2016. “Key technologies and challenges for air cooling of wide band-gap electronics.” EVTeC and APE 2016, Yokohama, Japan.
49.Dede, E.M., 2015. “Design optimization of a multi-device single-phase branching microchannel cold plate.” Electronics Cooling Magazine.
50.Zhou, F., Liu, Y., Joshi, S.N., Liu, Y., and Dede, E.M., 2015. “Modular flow structure design for a single-phase manifold microchannel cold plate.” ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2015), InterPACKICNMM2015-48029, San Francisco, CA. DOI: 10.1115/IPACK2015-48029
51.Dede, E.M., and Joshi, S.N., 2015. “Implications of high heat fluxes on cold plate design for automotive electronics.” ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2015), InterPACKICNMM2015-48028, San Francisco, CA.
52.Dede, E.M., Joshi, S.N., and Zhou, F., 2015. “Topology optimization, additive layer manufacturing, and experimental testing of an air-cooled heat sink.” ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2015), InterPACKICNMM2015-48027, San Francisco, CA. DOI: 10.1115/IPACK2015-48027 (Outstanding Paper Award)
53.Zhou, F., Dede, E.M., and Joshi, S.N., 2015. “A novel design of hybrid slot jet and mini-channel cold plate for electronics cooling.” SEMI-THERM 31, San Jose, CA. DOI:10.1109/SEMI-THERM.2015.7100141
54.Qian, X., and Dede, E.M., 2015. “Continuous adjoint based topology optimization of a constrained thermal-fluid system.” 11th World Congress on Structural and Multidisciplinary Optimization (WCSMO-11), Sydney, Australia.
55.Lohan, D.J., Dede, E.M., and Allison, J.T., 2015. “Topology optimization for heat conduction using generative design algorithms.” 11th World Congress on Structural and Multidisciplinary Optimization (WCSMO-11), Sydney, Australia.
56.Nomura, T., Dede, E.M., Matsumori, T., and Kawamoto, A., 2015. “Simultaneous optimization of topology and orientation of anisotropic material using isoparametric projection method.” 11th World Congress on Structural and Multidisciplinary Optimization (WCSMO-11), Sydney, Australia.
57.Dede, E.M., 2014. “Application of multi-physics approaches in engineering problems.” Tools and Methods of Competitive Engineering Symposium (TMCE 2014). Budapest, Hungary. (Invited Industrial Tutorial Talk)
58.Zhou, F., Joshi, S., and Dede, E.M., 2014. “Visualization of bubble behavior for jet impingement cooling with phase change.” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm-ECTC 2014), Orlando, FL. DOI: 10.1109/ITHERM.2014.6892376
59.Dede, E.M., and Nomura, T., 2014. “Topology optimization of a hybrid vehicle power electronics cold plate - application to the design of a fluid distribution structure.” EVTeC and APE 2014, Yokohama, Japan.
60.Dede, E.M., 2014. “Single-phase microchannel cold plate for hybrid vehicle electronics.” SEMI-THERM 30, San Jose, CA. DOI: 10.1109/SEMI-THERM.2014.6892227
61.Joshi, S.N., Rau, M.J., and Dede, E.M., 2013. “An experimental study of a single-device jet impingement cooler with phase change using HFE-7100 and a vapor extraction manifold.” ASME 2013 International Mechanical Engineering Congress and Exhibition (IMECE13), IMECE2013-63249, San Diego, CA. DOI: 10.1115/IMECE2013-63249
62.Joshi, S.N., Rau, M.J., Dede, E.M., and Garimella, S.V., 2013. “An experimental study of a multi-device jet impingement cooler with phase change using HFE-7100.” ASME Summer Heat Transfer Conference (HT2013), Minneapolis, MN. DOI: 10.1115/HT2013-17059
63.Dede, E.M., Nomura, T., and Lee, J., 2013. “Heat flow control via optimized composite structures.” 10th World Congress on Structural and Multidisciplinary Optimization (WCSMO-10), Orlando, FL.
64.Nomura, T., Yoon, S.W., Lee, J., and Dede, E.M., 2013. “Thermal stress minimization of directly bonded copper substrates using level set method based topology optimization.” 10th World Congress on Structural and Multidisciplinary Optimization (WCSMO-10), Orlando, FL.
65.Dede, E.M., 2012. “Investigation of liquid flow in a multi-pass branching microchannel system.” ASME 2012 International Mechanical Engineering Congress and Exhibition (IMECE12), IMECE2012-85483, Houston, TX. DOI: 10.1115/IMECE2012-85483
66.Lee, J., Nomura, T., and Dede, E.M., 2012. “Design optimization of magnetic fluid cooling system.” ASME 2012 International Mechanical Engineering Congress and Exhibition (IMECE12), IMECE2012-85817, Houston, TX. DOI: 10.1115/IMECE2012-85817
67.Dede, E.M., 2012. “Multiphysics modeling solutions for advanced vehicle research & development.” COMSOL Conference 2012, Boston, MA. (Keynote Presentation)
68.Zhu, G., and Dede, E.M., 2012. “Numerical simulation of phonon dispersion relations for phononic crystals.” Proceedings of the COMSOL Conference, Boston, MA.
69.Banerjee, D., Lee, J., Dede, E.M., and Iizuka, H., 2012. “Kilohertz magnetic field focusing in a pair of metallic periodic-ladder structures.” 3rd International Conference on Metamaterials, Photonic Crystals, and Plasmonics (META’12), Paris, France.
70.Dede, E.M., Guo, Y., Lee, J., and Nomura, T., 2012. “Multiphysics simulation and optimization for thermal management of electronics systems.” Applied Power Electronics Conference (APEC 2012), Orlando, FL. (Invited Presentation)
71.Lee, J., Dede, E.M., Banerjee, D., and Iizuka, H., 2011. “Design of air-gap magnetic field distribution in actuators using topology optimization.” 11th US National Congress on Computational Mechanics (USNCCM 2011), Minneapolis, MN.
72.Dede, E.M., 2011. “Experimental investigation of the thermal performance of a manifold hierarchical microchannel cold plate.” ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS (InterPACK 2011), Portland, OR. DOI: 10.1115/IPACK2011-52023
73.Dede, E.M., and Liu, Y., 2011. “Scale effects on thermal-fluid performance of optimized hierarchical structures.” ASME/JSME 8th Thermal Engineering Joint Conference (AJTEC 2011), Honolulu, HI. DOI: 10.1115/AJTEC2011-44082.
74.Dede, E.M., 2010. “The influence of channel aspect ratio on the performance of optimized thermal-fluid structures.” Proceedings of the COMSOL Conference, Boston, MA.
75.Dede, E.M., 2010. “Multiphysics optimization of hierarchical thermal-fluid structures.” 9th World Congress on Computational Mechanics and 4th Asian Pacific Congress on Computational Mechanics (WCCM/APCOM 2010), Sydney, Australia.
76.Tarle, G., et al., 2010. “Large format filter changer mechanism for the dark energy survey.” Modern Technologies in Space and Ground-based Telescopes and Instrumentation, Proceedings of SPIE, Vol. 7739, 77393L, San Diego, CA. DOI: 10.1117/12.857426.
77.Dede, E.M., 2010. “Multiphysics optimization, synthesis, and application of jet impingement target surfaces.” 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas, NV. DOI: 10.1109/ITHERM.2010.5501408.
78. Dede, E.M., 2009. “Multiphysics topology optimization of heat transfer and fluid flow systems.” Proceedings of the COMSOL Conference, Boston, MA. (Best Paper Award)
79. Dede, E.M., and Hulbert, G.M., 2009. “Conceptual design of tunable structures for mid-frequency response.” 50th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, AIAA-2009-2111, Palm Springs, CA.
80. DePoy, D.L., et al., 2008. “The Dark Energy Camera (DECam).” Ground-based and Airborne Instrumentation for Astronomy II, Proceedings of SPIE, vol. 7014, 70140E, Marseille, France. DOI: 10.1117/12.789466.
81. Hulbert, G.M., Dede, E.M., Yilmaz, C., Ma, Z.-D., and Kikuchi, N., 2008. “Analysis and design of materials and structures for attenuating vibration and acoustic response.” Proceedings of the 6th International Conference on Computation of Shell and Spatial structures, Ithaca, NY.
82. Dede, E.M., and Hulbert, G.M., 2007. “Mid-frequency response of structures with integral compliant mechanisms: verification and validation.” 9th US National Congress on Computational Mechanics, San Francisco (USNCCM 2007), CA.
83. Dede, E.M., and Hulbert, G.M., 2006. “Analysis, design, and optimization of structures with integral compliant mechanisms for mid-frequency response.” 7th World Congress on Computational Mechanics (WCCM 2006), Los Angeles, CA.
PATENTS (160+ Issued Patents)
SERVICE
-ASME Journal of Electronic Packaging, Associate Editor (2024)
-ASME Open Journal of Engineering, Associate Editor (2024)
AWARDS
-2020 IEEE Electronics Packaging Society (EPS), Transactions on Components, Packaging and Manufacturing Technology (TCPMT) Best Paper Award, Components: Characterization and Modeling Category
-2020 Journal of Electronic Packaging, Best Associate Editor of the Year
-2016 R&D 100 Award, Wolfspeed Wide Bandgap Automotive Traction Inverter (Co-developer)
-2015 ASME InterPACK, Outstanding Paper Award
-2013 R&D 100 Award, Multi-Pass Branching Microchannel Cold Plate (Principal developer)
-2012/2013 ASME Electronic & Photonic Packaging Division (EPPD), Journal of Electronic Packaging, Best Paper Award
-2009 COMSOL Conference, Best Paper Award
DISSERTATION
Dede, E.M., 2007. Analysis, design, and optimization of structures with integral compliant mechanisms for mid-frequency response. Ph.D. Dissertation, University of Michigan, Ann Arbor, MI.